Invention Grant
US08415207B2 Module including a sintered joint bonding a semiconductor chip to a copper surface
有权
模块包括将半导体芯片接合到铜表面的烧结接头
- Patent Title: Module including a sintered joint bonding a semiconductor chip to a copper surface
- Patent Title (中): 模块包括将半导体芯片接合到铜表面的烧结接头
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Application No.: US13591607Application Date: 2012-08-22
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Publication No.: US08415207B2Publication Date: 2013-04-09
- Inventor: Karsten Guth , Ivan Nikitin
- Applicant: Karsten Guth , Ivan Nikitin
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface.
Public/Granted literature
- US20120312864A1 MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A COPPER SURFACE Public/Granted day:2012-12-13
Information query
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