Invention Grant
- Patent Title: Method of manufacturing a DMOS trench transistor
- Patent Title (中): 制造DMOS沟槽晶体管的方法
-
Application No.: US11638612Application Date: 2006-12-13
-
Publication No.: US08415219B2Publication Date: 2013-04-09
- Inventor: Franz Hirler , Helmut Strack
- Applicant: Franz Hirler , Helmut Strack
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE10239861 20020829
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
To attain a comparatively high breakdown voltage at a high avalanche strength and with the physical size simultaneously being as small as possible, the invention proposes constructing a transistor device in a semiconductor material region in which a first source/drain region is used as a source region and in which the source region has a comparatively reduced surface charge or surface charge density.
Public/Granted literature
- US20070099373A1 Method for manufacturing an integrated semiconductor transistor device with parasitic bipolar transistor Public/Granted day:2007-05-03
Information query
IPC分类: