Invention Grant
- Patent Title: Chip identification for organic laminate packaging and methods of manufacture
- Patent Title (中): 有机层压包装的芯片识别和制造方法
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Application No.: US12756284Application Date: 2010-04-08
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Publication No.: US08415260B2Publication Date: 2013-04-09
- Inventor: Albert J. Banach , Timothy H. Daubenspeck , Wolfgang Sauter
- Applicant: Albert J. Banach , Timothy H. Daubenspeck , Wolfgang Sauter
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A chip identification for organic laminate packaging and methods of manufacture is provided. The method includes forming a material on a wafer which comprises a plurality of chips. The method further includes modifying the material to provide a unique identification for each of the plurality of chips on the wafer. The organic laminate structure includes a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip.
Public/Granted literature
- US20110248412A1 CHIP IDENTIFICATION FOR ORGANIC LAMINATE PACKAGING AND METHODS OF MANUFACTURE Public/Granted day:2011-10-13
Information query
IPC分类:
