Invention Grant
US08415410B2 Aromatic polycarbonate resin composition and a molded article thereof 有权
芳香族聚碳酸酯树脂组合物及其成型体

  • Patent Title: Aromatic polycarbonate resin composition and a molded article thereof
  • Patent Title (中): 芳香族聚碳酸酯树脂组合物及其成型体
  • Application No.: US12935422
    Application Date: 2009-03-26
  • Publication No.: US08415410B2
    Publication Date: 2013-04-09
  • Inventor: Akihiro Nitta
  • Applicant: Akihiro Nitta
  • Applicant Address: JP Tokyo
  • Assignee: Teijin Chemicals, Ltd.
  • Current Assignee: Teijin Chemicals, Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Wenderoth, Lind & Ponack, L.L.P.
  • Priority: JP2008-090880 20080331; JP2009-011912 20090122
  • International Application: PCT/JP2009/056833 WO 20090326
  • International Announcement: WO2009/123271 WO 20091008
  • Main IPC: C08K9/00
  • IPC: C08K9/00 C08K3/10
Aromatic polycarbonate resin composition and a molded article thereof
Abstract:
A resin composition for giving molded articles that effectively block heat radiation from sunlight and are excellent in transparency, and molded articles thereof. The resin composition comprises an aromatic polycarbonate resin (Component A), hexaboride particles of at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sr and Ca (Component B-1) and other resin different from Component A (Component B-2), wherein the total content of Component B-1 and Component B-2 is 0.001 to 1 part by weight per 100 parts by weight of Component A, the resin composition contains particles (1) composed of Component B-1 and particles (2) composed of Component B-1 and Component B-2, both the particles (1) and (2) having a number average secondary particle diameter of 50 μm or less and a maximum secondary particle diameter of 300 μm or less.
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