Invention Grant
- Patent Title: Multilayer circuit substrate
- Patent Title (中): 多层电路基板
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Application No.: US12585293Application Date: 2009-09-10
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Publication No.: US08415565B2Publication Date: 2013-04-09
- Inventor: Shigeki Nagase , Motoo Nakai , Kouya Yoshida , Hiroshi Sumasu , Nobuhiro Uchida
- Applicant: Shigeki Nagase , Motoo Nakai , Kouya Yoshida , Hiroshi Sumasu , Nobuhiro Uchida
- Applicant Address: JP Osaka
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-237471 20080917
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.
Public/Granted literature
- US20100065307A1 Multilayer circuit substrate Public/Granted day:2010-03-18
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