Invention Grant
US08415586B2 Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses
有权
通过最小化清洁脉冲数来提高消除焊料掩模吞吐量的方法
- Patent Title: Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses
- Patent Title (中): 通过最小化清洁脉冲数来提高消除焊料掩模吞吐量的方法
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Application No.: US12581008Application Date: 2009-10-16
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Publication No.: US08415586B2Publication Date: 2013-04-09
- Inventor: Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
- Applicant: Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Stoel Rives LLP
- Main IPC: B23K26/38
- IPC: B23K26/38
Abstract:
In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
Public/Granted literature
- US20100032417A1 MICROMACHINING WITH SHORT-PULSED, SOLID-STATE UV LASER Public/Granted day:2010-02-11
Information query
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