Invention Grant
- Patent Title: Heating resistance element component and thermal printer
- Patent Title (中): 加热电阻元件和热敏打印机
-
Application No.: US12286879Application Date: 2008-10-02
-
Publication No.: US08415589B2Publication Date: 2013-04-09
- Inventor: Toshimitsu Morooka , Norimitsu Sanbongi , Yoshinori Sato , Noriyoshi Shoji , Keitaro Koroishi
- Applicant: Toshimitsu Morooka , Norimitsu Sanbongi , Yoshinori Sato , Noriyoshi Shoji , Keitaro Koroishi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2007-259404 20071003
- Main IPC: H05B11/00
- IPC: H05B11/00 ; B41J2/335
Abstract:
A heating resistance element component has a supporting substrate, an insulating film laminated on the supporting substrate, heating resistors arranged at intervals on the insulating film, a common wire connected to one end of each of the heating resistors, and individual wires each connected to another end of the each of the of heating resistors. A surface of the supporting substrate is formed with a first concave portion and a second concave portion. The first concave portion is arranged in a region opposed to heating portions of the heating resistors. The second concave portion is arranged at an interval in a vicinity of the first concave portion so that heat generated by the heating portions of the plurality of heating resistors is prevented from flowing into the supporting substrate.
Public/Granted literature
- US20090090703A1 Heating resistance element component and thermal printer Public/Granted day:2009-04-09
Information query
