Invention Grant
US08415682B2 Light emitting semiconductor device having an improved outward luminosity efficiency and fabrication method for the light emitting semiconductor device 有权
具有改善的向外发光效率的发光半导体器件和用于发光半导体器件的制造方法

  • Patent Title: Light emitting semiconductor device having an improved outward luminosity efficiency and fabrication method for the light emitting semiconductor device
  • Patent Title (中): 具有改善的向外发光效率的发光半导体器件和用于发光半导体器件的制造方法
  • Application No.: US12318118
    Application Date: 2008-12-22
  • Publication No.: US08415682B2
    Publication Date: 2013-04-09
  • Inventor: Yasuo NakanishiMasayuki SonobeKazuaki Tsutsumi
  • Applicant: Yasuo NakanishiMasayuki SonobeKazuaki Tsutsumi
  • Applicant Address: JP Kyoto-shi, Kyoto-fu
  • Assignee: Rohm Co., Ltd.
  • Current Assignee: Rohm Co., Ltd.
  • Current Assignee Address: JP Kyoto-shi, Kyoto-fu
  • Agency: Rabin & Berdo, P.C.
  • Priority: JP2007-340469 20071228; JP2008-006943 20080116; JP2008-304190 20081128
  • Main IPC: H01L27/00
  • IPC: H01L27/00
Light emitting semiconductor device having an improved outward luminosity efficiency and fabrication method for the light emitting semiconductor device
Abstract:
A semiconductor light emitting device and a fabrication method for the semiconductor light emitting device whose outward luminous efficiency improved are provided and the semiconductor light emitting device includes a substrate; a protective film placed on the substrate; an n-type semiconductor layer which is placed on the substrate pinched by a protective film and on the protective film, and is doped with an n-type impurity; an active layer placed on the n-type semiconductor layer, and a p-type semiconductor layer placed on the active layer and is doped with a p-type impurity.
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