Invention Grant
US08415729B2 Power device with trenched gate structure and method of fabricating the same
有权
具有沟槽栅极结构的功率器件及其制造方法
- Patent Title: Power device with trenched gate structure and method of fabricating the same
- Patent Title (中): 具有沟槽栅极结构的功率器件及其制造方法
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Application No.: US13081500Application Date: 2011-04-07
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Publication No.: US08415729B2Publication Date: 2013-04-09
- Inventor: Tieh-Chiang Wu , Yi-Nan Chen , Hsien-Wen Liu
- Applicant: Tieh-Chiang Wu , Yi-Nan Chen , Hsien-Wen Liu
- Applicant Address: TW Kueishan, Tao-Yuan Hsien
- Assignee: Nanya Technology Corp.
- Current Assignee: Nanya Technology Corp.
- Current Assignee Address: TW Kueishan, Tao-Yuan Hsien
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A power device with trenched gate structure, includes: a substrate having a first face and a second face opposing to the first face, a body region of a first conductivity type disposed in the substrate, a base region of a second conductivity type disposed in the body region, a cathode region of the first conductivity type disposed in the base region, an anode region of the second conductivity type disposed in the substrate at the second face a trench disposed in the substrate and extending from the first face into the body region, and the cathode region encompassing the trench, wherein the trench has a wavelike sidewall, a gate structure disposed in the trench and an accumulation region disposed in the body region and along the wavelike sidewall. The wavelike sidewall can increase the base current of the bipolar transistor and increase the performance of the IGBT.
Public/Granted literature
- US20120256230A1 POWER DEVICE WITH TRENCHED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2012-10-11
Information query
IPC分类: