Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13264955Application Date: 2010-04-28
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Publication No.: US08415753B2Publication Date: 2013-04-09
- Inventor: Takashi Nakagawa , Naomu Kitano , Kazuaki Matsuo , Motomu Kosuda , Toru Tatsumi
- Applicant: Takashi Nakagawa , Naomu Kitano , Kazuaki Matsuo , Motomu Kosuda , Toru Tatsumi
- Applicant Address: JP Kawasaki-shi
- Assignee: Canon Anelva Corporation
- Current Assignee: Canon Anelva Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2009-108996 20090428
- International Application: PCT/JP2010/003038 WO 20100428
- International Announcement: WO2010/125810 WO 20101104
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/336

Abstract:
This invention provides a semiconductor device having a field effect transistor comprising a gate electrode comprising a metal nitride layer and a polycrystalline silicon layer, and the gate electrode is excellent in thermal stability and realizes a desired work function. In the semiconductor device, a gate insulating film 6 on a silicon substrate 5 has a high-permittivity insulating film formed of a metal oxide, a metal silicate, a metal oxide introduced with nitrogen, or a metal silicate introduced with nitrogen, the gate electrode has a first metal nitride layer 7 provided on the gate insulating film 6 and containing Ti and N, a second metal nitride layer 8 containing Ti and N, and a polycrystalline silicon layer 9, in the first metal nitride layer 7, a molar ratio between Ti and N (N/Ti) is not less than 1.1, and a crystalline orientation X1 is 1.1
Public/Granted literature
- US20120043617A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-02-23
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