Invention Grant
US08415778B2 Non-leaded integrated circuit package system with multiple ground sites
有权
无铅集成电路封装系统，具有多个接地点
- Patent Title: Non-leaded integrated circuit package system with multiple ground sites
- Patent Title (中): 无铅集成电路封装系统，具有多个接地点
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Application No.: US13215131Application Date: 2011-08-22
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Publication No.: US08415778B2Publication Date: 2013-04-09
- Inventor: Jeffrey D. Punzalan , Byung Tai Do , Henry D. Bathan , Zigmund Ramirez Camacho
- Applicant: Jeffrey D. Punzalan , Byung Tai Do , Henry D. Bathan , Zigmund Ramirez Camacho
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent John Yang
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.
Public/Granted literature
- US20110298108A1 NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE GROUND SITES Public/Granted day:2011-12-08
Information query
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