A semiconductor package system is provided including: a semiconductor chip; a substrate having a substrate opening and a vertical build-up wing, the substrate having the semiconductor chip mounted thereon with the vertical build-up wing circumscribed by vertical planes of a perimeter of, and spaced apart from, the semiconductor chip; a first heat slug attached above the substrate at a first horizontal plane and to a first surface of the semiconductor chip, the semiconductor chip at least partially encapsulated by the first heat slug; and a second heat slug attached to the substrate at a second horizontal plane above the first horizontal plane and to a second surface of the semiconductor chip through the substrate opening.