Invention Grant
- Patent Title: Integrated circuits having interconnects and heat dissipators based on nanostructures
- Patent Title (中): 具有基于纳米结构的互连和散热器的集成电路
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Application No.: US13476417Application Date: 2012-05-21
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Publication No.: US08415787B2Publication Date: 2013-04-09
- Inventor: Mohammad Shafiqul Kabir
- Applicant: Mohammad Shafiqul Kabir
- Applicant Address: SE Göteborg
- Assignee: Smoltek AB
- Current Assignee: Smoltek AB
- Current Assignee Address: SE Göteborg
- Agency: Fish & Richardson P.C.
- Priority: SE0501888 20050826
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
The present invention relates to a heat dissipator that includes a conductive substrate and a plurality of nanostructures supported by the conductive substrate. The nanostructures are at least partly embedded in an insulator. Each of the nanostructures includes a plurality of intermediate layers on the conductive substrate. At least two of the plurality of intermediate layers are interdiffused, and material of the at least two of the plurality of intermediate layers that are interdiffused is present in the nanostructure.
Public/Granted literature
- US20120224327A1 Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures Public/Granted day:2012-09-06
Information query
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