Invention Grant
US08415804B2 Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
有权
半导体芯片及其制造方法，以及包括其的堆叠模块和存储卡
- Patent Title: Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
- Patent Title (中): 半导体芯片及其制造方法，以及包括其的堆叠模块和存储卡
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Application No.: US12639241Application Date: 2009-12-16
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Publication No.: US08415804B2Publication Date: 2013-04-09
- Inventor: Ho-jin Lee , Dong-hyun Jang , In-young Lee , Min-seung Yoon , Son-kwan Hwang
- Applicant: Ho-jin Lee , Dong-hyun Jang , In-young Lee , Min-seung Yoon , Son-kwan Hwang
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2009-0058315 20090629
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/44
Abstract:
A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.
Public/Granted literature
- US20100327422A1 SEMICONDUCTOR CHIP, METHOD OF FABRICATING THE SAME, AND STACK MODULE AND MEMORY CARD INCLUDING THE SAME Public/Granted day:2010-12-30
Information query
IPC分类:
