Invention Grant
- Patent Title: Materials and methods for stress reduction in semiconductor wafer passivation layers
- Patent Title (中): 半导体晶片钝化层应力减少的材料和方法
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Application No.: US12874767Application Date: 2010-09-02
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Publication No.: US08415812B2Publication Date: 2013-04-09
- Inventor: Stephen M Dershem , Farhad G Mizori , James T Huneke
- Applicant: Stephen M Dershem , Farhad G Mizori , James T Huneke
- Applicant Address: US CA San Diego
- Assignee: Designer Molecules, Inc.
- Current Assignee: Designer Molecules, Inc.
- Current Assignee Address: US CA San Diego
- Agency: The Law Office of Jane K. Babin, Professional Corporation
- Agent Jane K. Babin
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/312
Abstract:
The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.
Public/Granted literature
- US20110049731A1 MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS Public/Granted day:2011-03-03
Information query
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