Invention Grant
- Patent Title: Vibrating piece manufacturing method and vibrator manufacturing method
- Patent Title (中): 振动片制造方法和振动器制造方法
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Application No.: US13460277Application Date: 2012-04-30
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Publication No.: US08415863B2Publication Date: 2013-04-09
- Inventor: Takashi Yamazaki , Tsukasa Funasaka , Takeo Funakawa , Makoto Furuhata
- Applicant: Takashi Yamazaki , Tsukasa Funasaka , Takeo Funakawa , Makoto Furuhata
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-005768 20080115
- Main IPC: H03H9/19
- IPC: H03H9/19 ; H03H9/21

Abstract:
A vibrating piece manufacturing method includes: (a) preparing a supporting body having first and second surfaces, the first and second surfaces defining a thickness while being directed toward opposite directions, the supporting body including a base and a plurality of arms, the arms extending side-by-side in a direction orthogonal to a direction of the thickness from the base, a lower electrode film being disposed on the first surface of each of the arms, a piezoelectric film being disposed on the lower electrode films, at least one upper electrode film being disposed on the piezoelectric film, at least a part of the second surface of each of the arms being an exposed area; and (b) etching the exposed area of the second surface so as to reduce the thickness to reduce flexural rigidity of the arms with respect to the thickness direction.
Public/Granted literature
- US20120212109A1 VIBRATING PIECE MANUFACTURING METHOD AND VIBRATOR MANUFACTURING METHOD Public/Granted day:2012-08-23
Information query
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