Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US12797174Application Date: 2010-06-09
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Publication No.: US08416048B2Publication Date: 2013-04-09
- Inventor: Katsunori Tawa
- Applicant: Katsunori Tawa
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.; John F. Guay
- Priority: JP2009-150418 20090625
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28

Abstract:
An electronic component includes overlapping coils in a rectangular laminate to form a substantially annular orbit. The orbit passes about an intersection of diagonal lines of an insulator layer of the laminate and is divided into a first orbit portion and a second orbit portion by a straight line parallel to a short side of the insulator layer. When an orbit obtained by the axisymmetric movement of the first orbit portion relative to the straight line is defined as a third orbit portion, a part of the second orbit portion overlaps with a part of the third orbit portion, and the non overlapped portion of the second orbit portion is positioned closer to the intersection than the non overlapped portion of the third orbit portion. A via hole conductor is provided in a region outboard an outer side of the non overlapping portion of the second orbit portion and inboard an outer side of the non overlapping portion of the third orbit portion.
Public/Granted literature
- US20100328009A1 ELECTRONIC COMPONENT Public/Granted day:2010-12-30
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