Invention Grant
- Patent Title: Circuit board integrated motion sensor
- Patent Title (中): 电路板集成运动传感器
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Application No.: US12807023Application Date: 2010-08-26
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Publication No.: US08416094B2Publication Date: 2013-04-09
- Inventor: Normand Dery , Minas Minassian
- Applicant: Normand Dery , Minas Minassian
- Applicant Address: US CA Vista
- Assignee: DEI Headquarters, Inc.
- Current Assignee: DEI Headquarters, Inc.
- Current Assignee Address: US CA Vista
- Agent K C Bean, Esq.
- Main IPC: G08B21/00
- IPC: G08B21/00

Abstract:
A motion sensor capable of detecting the direction of motion in three dimensions is disclosed. The motion sensor can be built into a printed circuit board allowing for simple and cost effective manufacturing. The motions sensor is designed to utilize a through hole in a printed circuit board, which is capped by on each side by housings creating a cavity where a spherical metal ball can move in three dimensions. This interior surface of the through hole and the housings have conductive element that when in contact with the spherical metal ball close a circuit creating an electrical signal indicative of direction.
Public/Granted literature
- US20120050057A1 Circuit board integrated motion sensor Public/Granted day:2012-03-01
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