A plurality of image pickup areas is disposed in a semiconductor substrate so as to be separate from one another. Disposed in each of the image pickup areas are rows and columns of unit pixels, each of which includes a photoelectric conversion part and signal scanning circuit parts. Formed on the image pickup areas of the semiconductor substrate and opposite a interconnect layer formed on the semiconductor substrate are optical image formation lenses used for forming object images. Further, between the image pickup areas on the semiconductor substrate is a driving circuit area in which driving circuits are formed for driving the signal scanning circuit parts.