Invention Grant
- Patent Title: Fluid cooling
- Patent Title (中): 流体冷却
-
Application No.: US13122877Application Date: 2010-08-10
-
Publication No.: US08416573B2Publication Date: 2013-04-09
- Inventor: Yoko Hamano , Takahisa Kusuura
- Applicant: Yoko Hamano , Takahisa Kusuura
- Applicant Address: US DE Wilmington
- Assignee: Empire Technology Development LLC.
- Current Assignee: Empire Technology Development LLC.
- Current Assignee Address: US DE Wilmington
- Agency: Woodcock Washburn LLP
- International Application: PCT/JP2010/005030 WO 20100810
- International Announcement: WO2012/020453 WO 20120216
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A fluid cooling system comprising a pipe unit through which coolant fluid flows. The pipe unit is provided with one or more actuators at least a part of which is formed of shape memory alloy. The actuators are configured to extend by applied heat.
Public/Granted literature
- US20120037341A1 Fluid Cooling Public/Granted day:2012-02-16
Information query
