Invention Grant
US08416599B2 Metal oxide semiconductor (MOS) field effect transistor having trench isolation region and method of fabricating the same
有权
具有沟槽隔离区域的金属氧化物半导体(MOS)场效应晶体管及其制造方法
- Patent Title: Metal oxide semiconductor (MOS) field effect transistor having trench isolation region and method of fabricating the same
- Patent Title (中): 具有沟槽隔离区域的金属氧化物半导体(MOS)场效应晶体管及其制造方法
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Application No.: US12498652Application Date: 2009-07-07
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Publication No.: US08416599B2Publication Date: 2013-04-09
- Inventor: Myoung-Soo Kim
- Applicant: Myoung-Soo Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR2005-0049251 20050609
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A leakage current occurring on a boundary of a trench isolation region and an active region can be prevented in a Metal Oxide Semiconductor (MOS) Field Effect transistor, and a fabricating method thereof is provided. The transistor includes the trench isolation region disposed in a predetermined portion of a semiconductor substrate to define the active region. A source region and a drain region are spaced apart from each other within the active region with a channel region disposed between the source region and the drain region. A gate electrode crosses over the channel region between the source region and the drain region, and a gate insulating layer is disposed between the gate electrode and the channel region. An edge insulating layer thicker than the gate insulating layer is disposed on a lower surface of the gate electrode around the boundary of the trench isolation region and the active region.
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