Invention Grant
- Patent Title: Vibration pickup microphone
- Patent Title (中): 振动拾音麦克风
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Application No.: US12525673Application Date: 2008-02-28
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Publication No.: US08416978B2Publication Date: 2013-04-09
- Inventor: Mikio Fukuda
- Applicant: Mikio Fukuda
- Applicant Address: JP
- Assignee: Temco Japan Co., Ltd.
- Current Assignee: Temco Japan Co., Ltd.
- Current Assignee Address: JP
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: JP2007-049401 20070228
- International Application: PCT/JP2008/000376 WO 20080228
- International Announcement: WO2008/105180 WO 20080904
- Main IPC: H04R9/08
- IPC: H04R9/08

Abstract:
[Problem to be Solved] To provide a high-sensitive compact vibration pickup microphone, suitably used as a talking microphone in high ambient noise environments or as a speech recognition input microphone, with high microphone sensitivity, resistance to sliding noise, and insensitivity to external noise and vibration.[Solution] A vibration pickup microphone comprising a housing 1 provided with a first space 5 and a second space 6, an external diaphragm 2 disposed over the first space 5, and a microphone unit 3 that is contained in a rear end portion of the second space having an air gap 8 maintained 6, wherein by disposing the external diaphragm 2 over it, an air chamber 7 formed in the first space 5 and an air gap 8 formed in the second space 6 are communicated via a thin passageway 4, so that vibration of voice picked up by the external diaphragm 2 is transmitted to the microphone unit 3 as sound waves, and then frequency components higher than voice frequencies within frequency components of the sound waves are attenuated in its transmitting path.
Public/Granted literature
- US20100119086A1 VIBRATION PICKUP MICROPHONE Public/Granted day:2010-05-13
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