Invention Grant
- Patent Title: Modular access point
- Patent Title (中): 模块化接入点
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Application No.: US12055572Application Date: 2008-03-26
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Publication No.: US08417302B2Publication Date: 2013-04-09
- Inventor: Hui-Leng Lim , Pat Wallace , Ed Geiger , Phil Ballai , Curt Croley
- Applicant: Hui-Leng Lim , Pat Wallace , Ed Geiger , Phil Ballai , Curt Croley
- Applicant Address: US NY Holtsville
- Assignee: Symbol Technologies, Inc.
- Current Assignee: Symbol Technologies, Inc.
- Current Assignee Address: US NY Holtsville
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
Described is a modular access point for wireless communications. The access point includes a housing which has at least one module receiving slot and a first wireless communication radio. The radio communicates with a first wireless device via a first frequency band. The access point also includes a removable module configured for insertion into the module receiving slot. The module includes a second communication radio utilizing a second frequency band so that, when the removable module is inserted into the slot, the access point is capable of communicating with a second wireless device via at least one of the first and second frequency bands. The access point includes a plurality of antenna connectors which are connected to the first and second radios. The access point may utilize external antennas or internal antenna modules which interchangeably attachable to the antenna connectors.
Public/Granted literature
- US20080214251A1 Modular Access Point Public/Granted day:2008-09-04
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