Invention Grant
- Patent Title: Advanced process control for semiconductor processing
- Patent Title (中): 先进的半导体处理过程控制
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Application No.: US12426690Application Date: 2009-04-20
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Publication No.: US08417362B2Publication Date: 2013-04-09
- Inventor: Hsueh Chi Shen , Chun-Hsien Lin
- Applicant: Hsueh Chi Shen , Chun-Hsien Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G05B13/02
- IPC: G05B13/02 ; G06F19/00

Abstract:
A computer comprising a recordable medium on which is stored instructions for at least one model-based, run-to-run controller routine is provided. The computer includes instructions to receive a first dataset regarding a first wafer after a first process, to determine a process parameter for the first process for a second wafer using the first dataset; and to determine a second process parameter for a second process for the first wafer using the first dataset. In an embodiment, the first process is an etch process. In an embodiment, the second process is a planarization process.
Public/Granted literature
- US20090248187A1 ADVANCED PROCESS CONTROL FOR SEMICONDUCTOR PROCESSING Public/Granted day:2009-10-01
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