Invention Grant
- Patent Title: Modular integrated circuit with uniform address mapping
- Patent Title (中): 具有统一地址映射的模块化集成电路
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Application No.: US12767208Application Date: 2010-04-26
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Publication No.: US08417930B2Publication Date: 2013-04-09
- Inventor: Lawrence J. Madar, III , Mark N. Fullerton , Bhupesh Kharwa
- Applicant: Lawrence J. Madar, III , Mark N. Fullerton , Bhupesh Kharwa
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Stuckman
- Main IPC: G06F9/00
- IPC: G06F9/00 ; G06F9/24 ; G06F15/177

Abstract:
A modular integrated circuit includes a hub module that is coupled to a plurality of spoke modules via a plurality of hub interfaces. A memory module stores hub software and hub data and configuration data. The hub software operates in accordance with a memory map that includes a plurality of first reserved blocks corresponding to memory reserved for the plurality of spoke modules, and at least one second reserved block corresponding to memory reserved for at least one optional spoke module. The plurality of first reserved blocks are activated based on the configuration data and the at least one second reserved block is deactivated based on the configuration data.
Public/Granted literature
- US20110264930A1 MODULAR INTEGRATED CIRCUIT WITH UNIFORM ADDRESS MAPPING Public/Granted day:2011-10-27
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