Invention Grant
- Patent Title: Method of manufacturing an embedded printed circuit board
- Patent Title (中): 嵌入式印刷电路板的制造方法
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Application No.: US12213704Application Date: 2008-06-23
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Publication No.: US08418356B2Publication Date: 2013-04-16
- Inventor: Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
- Applicant: Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0027371 20080325
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H05K1/18 ; H05K3/32 ; H05K3/46
Abstract:
The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.
Public/Granted literature
- US20090242251A1 Embedded printed circuit board and manufacturing method thereof Public/Granted day:2009-10-01
Information query
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