Invention Grant
- Patent Title: Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device
- Patent Title (中): 导电性接合材料，导体接合方法以及半导体装置的制造方法
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Application No.: US13367509Application Date: 2012-02-07
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Publication No.: US08418910B2Publication Date: 2013-04-16
- Inventor: Takatoyo Yamakami , Takashi Kubota , Kuniko Ishikawa , Masayuki Kitajima
- Applicant: Takatoyo Yamakami , Takashi Kubota , Kuniko Ishikawa , Masayuki Kitajima
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire Sanders (US) LLP
- Priority: JP2011-031643 20110217
- Main IPC: B23K35/14
- IPC: B23K35/14 ; B23K35/34 ; B23K31/02
Abstract:
An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
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