Invention Grant
- Patent Title: Electronic device frame and support mechanism utilized thereby
- Patent Title (中): 由此利用电子装置框架和支撑机构
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Application No.: US12560522Application Date: 2009-09-16
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Publication No.: US08418985B2Publication Date: 2013-04-16
- Inventor: Wei-Jun Wang , Zi-Ming Tang
- Applicant: Wei-Jun Wang , Zi-Ming Tang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910304183 20090709
- Main IPC: F16M11/24
- IPC: F16M11/24 ; F16M13/00 ; H05K5/00

Abstract:
An electronic device frame includes a housing, a positioning member connecting with the housing, and an inner supporting mechanism. The inner supporting mechanism includes a support member fixed on the housing, a slider slidably connected to the support member, and a fastener connecting the support member to the slider. One of the slider and the supporting member defines a locking slot, in which the fastener is locked. The fastener can lock in any position along the locking slot, such that the slider can maintain different positions and resist the positioning member by moving relative to the supporting member.
Public/Granted literature
- US20110006647A1 ELECTRONIC DEVICE FRAME AND SUPPORT MECHANISM UTILIZED THEREBY Public/Granted day:2011-01-13
Information query
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