Invention Grant
- Patent Title: Fluid pump
- Patent Title (中): 流体泵
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Application No.: US12531741Application Date: 2008-03-10
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Publication No.: US08419347B2Publication Date: 2013-04-16
- Inventor: Colin Thomas Pomfret
- Applicant: Colin Thomas Pomfret
- Applicant Address: GB Warwick
- Assignee: Godiva Limited
- Current Assignee: Godiva Limited
- Current Assignee Address: GB Warwick
- Agency: Gordon & Jacobson, PC
- Priority: EP07104469 20070320
- International Application: PCT/GB2008/050167 WO 20080310
- International Announcement: WO2008/114045 WO 20080925
- Main IPC: F04D9/00
- IPC: F04D9/00

Abstract:
A fluid pump comprising a pump body, a low pressure impeller, a high pressure impeller, impeller seal means separating the inlet side of the low pressure impeller from its pressure side, a pump priming system, and a pump priming conduit provided through the low pressure impeller radially inboard of the impeller seal means. The high pressure impeller is preferably provided within a cavity, defined by an impeller recess and a cover plate. A wear ring is preferably provided between the low pressure impeller and the inboard end of the cover plate. The pump priming conduit preferably comprises: first and second axial bores through the pump body; a radial bore and two axial holes through the cover plate; an axial hole through the rear wear ring; a cavity between the wear ring and the low pressure impeller; and axial holes through the low pressure impeller, connecting the cavity to the suction side of the low pressure impeller.
Public/Granted literature
- US20100143106A1 Fluid Pump Public/Granted day:2010-06-10
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