Invention Grant
US08419400B2 Sintered body, sputtering target and molding die, and process for producing sintered body employing the same
有权
烧结体，溅射靶和成型模，以及使用该烧结体的烧结体的制造方法
- Patent Title: Sintered body, sputtering target and molding die, and process for producing sintered body employing the same
- Patent Title (中): 烧结体，溅射靶和成型模，以及使用该烧结体的烧结体的制造方法
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Application No.: US11815163Application Date: 2006-01-27
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Publication No.: US08419400B2Publication Date: 2013-04-16
- Inventor: Kenichi Itoh , Masami Mesuda , Hitoshi Nagayama , Tetsuo Shibutami , Shunsuke Yatsunami
- Applicant: Kenichi Itoh , Masami Mesuda , Hitoshi Nagayama , Tetsuo Shibutami , Shunsuke Yatsunami
- Applicant Address: JP Shunan-Shi
- Assignee: Tosoh Corporation
- Current Assignee: Tosoh Corporation
- Current Assignee Address: JP Shunan-Shi
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-025655 20050201
- International Application: PCT/JP2006/301357 WO 20060127
- International Announcement: WO2006/082760 WO 20060810
- Main IPC: B29C43/32
- IPC: B29C43/32
Abstract:
Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
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