Invention Grant
- Patent Title: Electroplating head and method for operating the same
- Patent Title (中): 电镀头及其操作方法
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Application No.: US12482171Application Date: 2009-06-10
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Publication No.: US08419917B2Publication Date: 2013-04-16
- Inventor: Yezdi Dordi , Bob Maraschin , John Boyd , Fred C. Redeker
- Applicant: Yezdi Dordi , Bob Maraschin , John Boyd , Fred C. Redeker
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: C25D5/20
- IPC: C25D5/20 ; C25D5/02 ; C25D5/00

Abstract:
An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.
Public/Granted literature
- US20090242413A1 Electroplating Head and Method for Operating the Same Public/Granted day:2009-10-01
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