Invention Grant
- Patent Title: Pattern forming method
- Patent Title (中): 图案形成方法
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Application No.: US12884617Application Date: 2010-09-17
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Publication No.: US08419950B2Publication Date: 2013-04-16
- Inventor: Hiroyuki Kashiwagi , Kazuya Fukuhara
- Applicant: Hiroyuki Kashiwagi , Kazuya Fukuhara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2009-219689 20090924
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
According to one embodiment, a pattern forming method is disclosed. The method includes contacting a template with light curable resin on a substrate. The template comprises a concave-convex pattern including concave portions and convex portions, and a metal layer provided on a convex portion of the concave-convex pattern. The concave-convex pattern is to be contacted with the light curable resin. The pattern forming method further includes irradiating the light curable resin with light of a predetermined wavelength under a condition ε1=−2ε2. Where ε1 is a complex relative permittivity of the metal layer corresponding to the predetermined wavelength, ε2 is a complex relative permittivity of the light curable resin corresponding to the predetermined wavelength.
Public/Granted literature
- US20110068081A1 Pattern Forming Method Public/Granted day:2011-03-24
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