Invention Grant
- Patent Title: Solid type rubber-based pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet thereof
- Patent Title (中): 固体型橡胶系粘合剂组合物及其压敏粘合片
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Application No.: US12305402Application Date: 2007-07-02
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Publication No.: US08420164B2Publication Date: 2013-04-16
- Inventor: Tomoo Yamaguchi , Yasunobu Ina , Tomoaki Uchiyama , Minoru Yagi
- Applicant: Tomoo Yamaguchi , Yasunobu Ina , Tomoaki Uchiyama , Minoru Yagi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-183161 20060703; JP2007-163420 20070621
- International Application: PCT/JP2007/063237 WO 20070702
- International Announcement: WO2008/004519 WO 20080110
- Main IPC: C09J133/08
- IPC: C09J133/08 ; B05D5/10

Abstract:
The present invention relates to a solid type rubber-based pressure-sensitive adhesive composition, which is prepared by adding a tackifier, a softener, and an isocyanate-based crosslinking agent reactable with active hydrogen into an acrylic rubber containing a monomer having an active hydrogen-containing functional group as a copolymerization component to thereby obtain a solventless and nonaqueous pressure-sensitive adhesive composition, and particularly it relates to a solid type rubber-based pressure-sensitive adhesive composition having the above-mentioned constitution, in which the above-mentioned acrylic rubber includes a copolymer containing butyl acrylate as a main component, and as the copolymerization component a monomer having a hydroxyl group or a carboxyl group as the active hydrogen-containing functional group.
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