Invention Grant
- Patent Title: Injection molding process for molding mechanical interlocks between molded components
- Patent Title (中): 用于在模制部件之间成型机械互锁的注模工艺
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Application No.: US13185017Application Date: 2011-07-18
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Publication No.: US08420197B2Publication Date: 2013-04-16
- Inventor: Jean-Pierre Giraud , Michel Zbirka
- Applicant: Jean-Pierre Giraud , Michel Zbirka
- Applicant Address: US NY Amsterdam
- Assignee: CSP Technologies, Inc.
- Current Assignee: CSP Technologies, Inc.
- Current Assignee Address: US NY Amsterdam
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: B32B7/08
- IPC: B32B7/08 ; B32B1/06

Abstract:
A two-shot or multi-shot multi-material injection molding process is provided. The process allows dissimilar materials to be injection molded to form a single, injection molded part by creating a structural interlock between the materials to prevent the materials from separating. The structural interlock is formed by forming at least one interlock cavity adjacent to a interfacial surface of a first portion of a molded part molded from a first material, and injecting a second, different material into the mold so that the second material flows into the interlock cavity and fills it. Solidification of the second material in the interlock cavity formed by the first material creates the structural interlock between the two materials.
Public/Granted literature
- US20120009410A1 INJECTION MOLDING PROCESS FOR MOLDING MECHANICAL INTERLOCKS BETWEEN MOLDED COMPONENTS Public/Granted day:2012-01-12
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