A polyamide molding composition with the following constitution is described: (a) from 40 to 90% by weight of a copolyamide, where this is composed of (a1) 1,6-hexanediamine and 1,10-decanediamine and also (a2) terephthalic acid and at least one other polyamide-forming monomer selected from the group of: dicarboxylic acid having from 8 to 18 carbon atoms, laurolactam, aminolauric acid, and/or mixtures thereof; (b) from 10 to 40% by weight of macromolecular plasticizers, with the proviso that these can have been replaced to some extent by low-molecular-weight plasticizers; (c) from 0 to 20% by weight of additives and/or added substances. Uses of this type of molding composition are also described, in particular for the production of a fuel line, cooling line, oil line or urea line for the automobile sector, as also are production processes to give moldings.