An electrode collector manufacturing apparatus (50) includes a chamber (51), the inside of which can be reduced in pressure, a substrate retaining mechanism (55) that retains a conductive substrate (12), and a gas introducing mechanism (54) that introduces a fluorine gas and an inert gas into the chamber (51). Inside the chamber (51) are provided an etching portion (52) that etches a surface of the substrate (12), and carbon film forming portions (56a) and (56b) that form a carbon film on the surface of the etched substrate (12). The gas introducing mechanism (54) is structured to create in the chamber a mixed gas atmosphere in which the fluorine and the inert gas are mixed at a predetermined molar ratio.