Invention Grant
- Patent Title: Positive photosensitive resin composition
- Patent Title (中): 正型感光性树脂组合物
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Application No.: US12834933Application Date: 2010-07-13
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Publication No.: US08420287B2Publication Date: 2013-04-16
- Inventor: Ji-Young Jeong , Min-Kook Chung , Hyun-Yong Cho , Doo-Young Jung , Jong-Hwa Lee , Yong-Sik Yoo , Jeong-Woo Lee , Hwan-Sung Cheon
- Applicant: Ji-Young Jeong , Min-Kook Chung , Hyun-Yong Cho , Doo-Young Jung , Jong-Hwa Lee , Yong-Sik Yoo , Jeong-Woo Lee , Hwan-Sung Cheon
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Summa, Additon & Ashe, P.A.
- Priority: KR10-2009-0108273 20091110
- Main IPC: G03F7/023
- IPC: G03F7/023

Abstract:
Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent.
Public/Granted literature
- US20110111346A1 Positive Photosensitive Resin Composition Public/Granted day:2011-05-12
Information query
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