Invention Grant
- Patent Title: Method of producing multilayer printed wiring board and photosensitive dry film used therefor
- Patent Title (中): 制造多层印刷线路板的方法和用于其的感光干膜
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Application No.: US12974081Application Date: 2010-12-21
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Publication No.: US08420300B2Publication Date: 2013-04-16
- Inventor: Akiyoshi Tsuda
- Applicant: Akiyoshi Tsuda
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-299506 20051014
- Main IPC: G03F1/06
- IPC: G03F1/06

Abstract:
A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof.
Public/Granted literature
- US20110183267A1 METHOD OF PRODUCING MULTILAYER PRINTED WIRING BOARD AND PHOTOSENSITIVE DRY FILM USED THEREFOR Public/Granted day:2011-07-28
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