Invention Grant
US08420300B2 Method of producing multilayer printed wiring board and photosensitive dry film used therefor 有权
制造多层印刷线路板的方法和用于其的感光干膜

Method of producing multilayer printed wiring board and photosensitive dry film used therefor
Abstract:
A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof.
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