Invention Grant
- Patent Title: Method of manufacturing a light-emitting device
- Patent Title (中): 制造发光装置的方法
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Application No.: US13093246Application Date: 2011-04-25
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Publication No.: US08420426B2Publication Date: 2013-04-16
- Inventor: Hideki Hirayama , Katsushi Akita , Takao Nakamura
- Applicant: Hideki Hirayama , Katsushi Akita , Takao Nakamura
- Applicant Address: JP Osaka-shi JP Wako-shi
- Assignee: Sumitomo Electric Industries, Ltd.,RIKEN
- Current Assignee: Sumitomo Electric Industries, Ltd.,RIKEN
- Current Assignee Address: JP Osaka-shi JP Wako-shi
- Agent W. F. Fasse
- Priority: JP2003-296474 20030820; JP2004-193809 20040630
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
To provide a light-emitting device using a nitride semiconductor which can attain high-power light emission by highly efficient light emission, a method of manufacturing the light-emitting device involves forming a first AlGaN layer of a first conductivity type on a side of a first main surface of a nitride semiconductor substrate, forming a light-emitting layer including an InAlGaN quaternary alloy on the first AlGaN layer, forming a second AlGaN layer of a second conductivity type on the light-emitting layer, and removing the nitride semiconductor substrate after forming the second AlGaN layer.
Public/Granted literature
- US20110201142A1 Method of Manufacturing a Light-Emitting Device Public/Granted day:2011-08-18
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