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US08420471B2 Dense pitch bulk FinFET process by selective EPI and etch 有权
通过选择性EPI和蚀刻的密集体积FinFET工艺

Dense pitch bulk FinFET process by selective EPI and etch
Abstract:
Disclosed is a method of forming a pair of transistors by epitaxially growing a pair of silicon fins on a silicon germanium fin on a bulk wafer. In one embodiment a gate conductor between the fins is isolated from a conductor layer on the bulk wafer so a front gate may be formed. In another embodiment a gate conductor between the fins contacts a conductor layer on the bulk wafer so a back gate may be formed. In yet another embodiment both of the previous structures are simultaneously formed on the same bulk wafer. The method allow the pairs of transistors to be formed with a variety of features.
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