Invention Grant
- Patent Title: Dense pitch bulk FinFET process by selective EPI and etch
- Patent Title (中): 通过选择性EPI和蚀刻的密集体积FinFET工艺
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Application No.: US13103569Application Date: 2011-05-09
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Publication No.: US08420471B2Publication Date: 2013-04-16
- Inventor: Brent A. Anderson , Edward J. Nowak
- Applicant: Brent A. Anderson , Edward J. Nowak
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Agent Richard M. Kotulak, Esq.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
Disclosed is a method of forming a pair of transistors by epitaxially growing a pair of silicon fins on a silicon germanium fin on a bulk wafer. In one embodiment a gate conductor between the fins is isolated from a conductor layer on the bulk wafer so a front gate may be formed. In another embodiment a gate conductor between the fins contacts a conductor layer on the bulk wafer so a back gate may be formed. In yet another embodiment both of the previous structures are simultaneously formed on the same bulk wafer. The method allow the pairs of transistors to be formed with a variety of features.
Public/Granted literature
- US20110207298A1 DENSE PITCH BULK FINFET PROCESS BY SELECTIVE EPI AND ETCH Public/Granted day:2011-08-25
Information query
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