Invention Grant
- Patent Title: SOI SiGe-base lateral bipolar junction transistor
- Patent Title (中): SOI SiGe基极横向双极结晶体管
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Application No.: US13556372Application Date: 2012-07-24
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Publication No.: US08420493B2Publication Date: 2013-04-16
- Inventor: Tak H. Ning , Kevin K. Chan , Marwan H. Khater
- Applicant: Tak H. Ning , Kevin K. Chan , Marwan H. Khater
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L21/336

Abstract:
A lateral heterojunction bipolar transistor (HBT) is formed on a semiconductor-on-insulator substrate. The HBT includes a base including a doped silicon-germanium alloy base region, an emitter including doped silicon and laterally contacting the base, and a collector including doped silicon and laterally contacting the base. Because the collector current is channeled through the doped silicon-germanium base region, the HBT can accommodate a greater current density than a comparable bipolar transistor employing a silicon channel. The base may also include an upper silicon base region and/or a lower silicon base region. In this case, the collector current is concentrated in the doped silicon-germanium base region, thereby minimizing noise introduced to carrier scattering at the periphery of the base. Further, parasitic capacitance is minimized because the emitter-base junction area is the same as the collector-base junction area.
Public/Granted literature
- US20120289018A1 SOI SiGe-BASE LATERAL BIPOLAR JUNCTION TRANSISTOR Public/Granted day:2012-11-15
Information query
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