Invention Grant
- Patent Title: Manufacturing approach for collector and a buried layer of bipolar transistor
- Patent Title (中): 集电极的制造方法和双极晶体管的埋层
-
Application No.: US12979999Application Date: 2010-12-28
-
Publication No.: US08420495B2Publication Date: 2013-04-16
- Inventor: Tzuyin Chiu , TungYuan Chu , YungChieh Fan , Wensheng Qian , Fan Chen , Jiong Xu , Haifang Zhang
- Applicant: Tzuyin Chiu , TungYuan Chu , YungChieh Fan , Wensheng Qian , Fan Chen , Jiong Xu , Haifang Zhang
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong Nec Electronics Company, Limited
- Current Assignee: Shanghai Hua Hong Nec Electronics Company, Limited
- Current Assignee Address: CN Shanghai
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: CN200910202080 20091231
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L21/428 ; H01L21/38 ; H01L21/00

Abstract:
This invention disclosed a manufacturing approach of collector and buried layer of a bipolar transistor. One aspect of the invention is that a pseudo buried layer, i.e, collector buried layer, is manufactured by ion implantation and thermal anneal. This pseudo buried layer has a small area, which makes deep trench isolation to divide pseudo buried layer unnecessary in subsequent process. Another aspect is, the doped area, i.e, collector, is formed by ion implantation instead of high cost epitaxy process. This invention simplified the manufacturing process, as a consequence, saved manufacturing cost.
Public/Granted literature
- US20110159672A1 Novel Manufacturing Approach for Collector and N Type Buried Layer Of Bipolar Transistor Public/Granted day:2011-06-30
Information query
IPC分类: