A package substrate may include an insulating substrate, first circuit patterns, second circuit patterns and a test pattern. The first circuit patterns may be arranged on the insulating substrate. The second circuit patterns may be arranged on the insulating substrate. The second circuit patterns may be arranged between the first circuit patterns. The test pattern may be electrically connected between same polar terminals of the first circuit patterns and the second circuit patterns. Thus, electrical connections between the semiconductor chip and the circuit patterns may be tested before performing a process for cutting the package substrate.