Invention Grant
- Patent Title: Printed circuit board and method for fabricating the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12956724Application Date: 2010-11-30
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Publication No.: US08420954B2Publication Date: 2013-04-16
- Inventor: Hsien-Chieh Lin , Tung-Yu Chang
- Applicant: Hsien-Chieh Lin , Tung-Yu Chang
- Applicant Address: TW Taoyuan County
- Assignee: Nan Ya PCB Corp.
- Current Assignee: Nan Ya PCB Corp.
- Current Assignee Address: TW Taoyuan County
- Priority: TW99127897A 20100820
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.
Public/Granted literature
- US20120043127A1 PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-02-23
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