Invention Grant
- Patent Title: Lead pin for package substrate
- Patent Title (中): 封装基板引脚
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Application No.: US12805413Application Date: 2010-07-29
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Publication No.: US08420955B2Publication Date: 2013-04-16
- Inventor: Jin Won Choi , Seung Jean Moon , Ki Taek Lee
- Applicant: Jin Won Choi , Seung Jean Moon , Ki Taek Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0089706 20090922
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K7/00 ; H01L23/495 ; H01L23/48

Abstract:
A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.
Public/Granted literature
- US20110067899A1 Lead pin for package substrate Public/Granted day:2011-03-24
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