Invention Grant
- Patent Title: Electrical device mounting adapter
- Patent Title (中): 电气设备安装适配器
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Application No.: US12768568Application Date: 2010-04-27
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Publication No.: US08420956B2Publication Date: 2013-04-16
- Inventor: R. David Alderson , Donald J. Hendler , Michael D. Williams
- Applicant: R. David Alderson , Donald J. Hendler , Michael D. Williams
- Applicant Address: US NY Melville
- Assignee: Leviton Manufacturing Co., Inc.
- Current Assignee: Leviton Manufacturing Co., Inc.
- Current Assignee Address: US NY Melville
- Agency: Marger Johnson & McCollom PC
- Main IPC: H02G3/08
- IPC: H02G3/08
Abstract:
In one embodiment, an adapter may include first and second mounting portions adapted to be attached to first and second mounting portions of an electrical device, and first and second spacers arranged to space the first and second mounting portion of the electrical device away from a building surface when the electrical device is mounted to an electrical box. In another embodiment, an adapter may include a ring to surround a body of a standard electrical device, and first and second slots to receive first and second mounting portion of the standard electrical device.
Public/Granted literature
- US20110259634A1 ELECTRICAL DEVICE MOUNTING ADAPTER Public/Granted day:2011-10-27
Information query
IPC分类:
