Invention Grant
- Patent Title: Apparatus for thermal processing with micro-environment
- Patent Title (中): 微环境热处理设备
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Application No.: US12590852Application Date: 2009-11-13
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Publication No.: US08420981B2Publication Date: 2013-04-16
- Inventor: Daniel Goodman , Arthur Keigler , David G. Guarnaccia , Matthew R. Jeffers
- Applicant: Daniel Goodman , Arthur Keigler , David G. Guarnaccia , Matthew R. Jeffers
- Applicant Address: US MA Billerica
- Assignee: Tel Nexx, Inc.
- Current Assignee: Tel Nexx, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Main IPC: H01L21/477
- IPC: H01L21/477 ; F27D11/00
Abstract:
A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region.
Public/Granted literature
- US20110114623A1 Apparatus for thermal processing with micro-environment Public/Granted day:2011-05-19
Information query
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