Invention Grant
- Patent Title: Test structure for charged particle beam inspection and method for defect determination using the same
- Patent Title (中): 带电粒子束检查的测试结构及使用其的缺陷测定方法
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Application No.: US12420224Application Date: 2009-04-08
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Publication No.: US08421009B2Publication Date: 2013-04-16
- Inventor: Hong Xiao
- Applicant: Hong Xiao
- Applicant Address: TW Hsinchu
- Assignee: Hermes Microvision, Inc.
- Current Assignee: Hermes Microvision, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: G01N23/00
- IPC: G01N23/00

Abstract:
A test structure and method thereof for determining a defect in a sample of semiconductor device includes at least one transistor rendered grounded. The grounded transistor is preferably located at at least one end of a test pattern designed to be included in the sample. When the test structure is inspected by charged particle beam inspection, the voltage contrast (VC) of the transistors in the test pattern including the grounded transistor is observed for determination of the presence of defect in the sample.
Public/Granted literature
- US20100258720A1 TEST STRUCTURE FOR CHARGED PARTICLE BEAM INSPECTION AND METHOD FOR DEFECT DETERMINATION USING THE SAME Public/Granted day:2010-10-14
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