Invention Grant
- Patent Title: Light emitting device, light emitting device package, and display device
- Patent Title (中): 发光装置,发光装置封装和显示装置
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Application No.: US13180418Application Date: 2011-07-11
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Publication No.: US08421099B2Publication Date: 2013-04-16
- Inventor: Hyun Don Song
- Applicant: Hyun Don Song
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2010-0067403 20100713
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device is provided that includes a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer, with a roughness formed in a surface of the first semiconductor layer; a phosphor layer arranged on the first semiconductor layer; and an adhesive activation layer arranged between the first semiconductor layer and the phosphor layer. The adhesive activation layer fills a concave part of the roughness and a boundary surface between the adhesive activation layer and the phosphor layer is level.
Public/Granted literature
- US20120012869A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND DISPLAY DEVICE Public/Granted day:2012-01-19
Information query
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