Invention Grant
- Patent Title: Structure and method to integrate embedded DRAM with finfet
- Patent Title (中): 嵌入式DRAM与finfet的结构和方法
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Application No.: US12755487Application Date: 2010-04-07
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Publication No.: US08421139B2Publication Date: 2013-04-16
- Inventor: Sivananda Kanakasabapathy , Hemanth Jagannathan , Geng Wang
- Applicant: Sivananda Kanakasabapathy , Hemanth Jagannathan , Geng Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Thomas Grzesik
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A transistor includes a first fin structure and at least a second fin structure formed on a substrate. A deep trench area is formed between the first and second fin structures. The deep trench area extends through an insulator layer of the substrate and a semiconductor layer of the substrate. A high-k metal gate is formed within the deep trench area. A polysilicon layer is formed within the deep trench area adjacent to the metal layer. The polysilicon layer and the high-k metal layer are recessed below a top surface of the insulator layer. A poly strap in the deep trench area is formed on top of the high-k metal gate and the polysilicon material. The poly strap is dimensioned to be below a top surface of the first and second fin structures. The first fin structure and the second fin structure are electrically coupled to the poly strap.
Public/Granted literature
- US20110248326A1 STRUCTURE AND METHOD TO INTEGRATE EMBEDDED DRAM WITH FINFET Public/Granted day:2011-10-13
Information query
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